Description

The protection of electronics and printed circuit boards with the hotmelt molding method is becoming more and more state of the art. This results also in an increases of requirements on the hotmelt material.

A test procedure, which is gaining in importance, is the so-called 85/85 test. The product will be exposed by a temperature of 85 ° C and humidity of 85%.1000 hours. For conventional hotmelt adhesives, this test is often a problem because the mechanical properties of hotmelt adhesive drop rapidly and permanent. Henkel has solved this issue with this new development of the OM 653 Macromelt hotmelt.

The hotmelt Macromelt OM 653:

• Is suitable for: temperature range from -40 ° C to +100 ° C
• adheres well to polar plastics such as PA, ABS and PVC
• keeps mechanical alues constant after the 85/85 test

Application for Macromelt OM 653 hot melt

Any sealing of electronics, such as sealing of printed circuit boards, electronic components, sensors or sealing of control units, if they have to be protected against environmental influences and go through the 85/85 Test

Data

Specifications of hot melt Macromelt OM 653 before and after the 85/85 Test