Simple method for sealing

Description

In the automotive industry for some years are hot melts for water tight connections prior art. More and more influence to win dieHotmelts where printed circuit boards must be protected from moisture, mechanical damage or against aggressive media.

The method is the relatively low processing temperature (about 210 ° C) and low injection pressure (from 5 to max. 40 bar) for components and printed circuit board very carefully.

The Macromelt-Schmelzgussverfahren based on the following parts: the material, the Vergussform, processing machinery and the know-how in the application.

Macromelt - the material
When hot melt adhesives are thermoplastic materials based on Polyamid.Die products Macromelt series are not only interesting from a technical but also from an environmental perspective, as they are produced from renewable resources.

During the processing will be no chemical reactions and no solvent is released. Macromelt is classified as self-extinguishing to UL 94 (V0).
 

Mould
The Moulds are made mostly of aluminum. Therefore, the mold is fastly built and inexpensive, aluminum is thermally advantageous and reduces the required demolding forces.
 

The processing machines Optimel
The hot melt is heated in the tank of Aufschmelzgeräts to about 210 ° C. After reaching the processing temperature the material is pumped with a gear pump through a heated hose to the injection head. The pump builds up pressure. The jet at the injection head is opened and closed and time-low pressure, the low viscosity melt is pumped into the Vergussform where even delicate components gently washed and thus seals and protects.

The cycle time (injection time and cooling time) is about 90 percent of the applications 10-45 seconds as a lengthy account of the curing hot melts. The applications of Macromelt-melt adhesives are almost unlimited. Nevertheless, we can mention a few main areas:
 

Connector moulding with Hot Melt
When Steckerverguss is the hot melt adhesive to produce the external form, used for sealing the connector and the cable for strain relief. The günstigenNiederdruck-injection molds Aluminiumermöglichen even in small batches in an economic and efficient production.
 

Casting of assembled printed circuit boards
When Elektronikverguss it is the low processing pressure and the low Vergusstemperatur who keep the electronic components from damage. This gives a resin that protects electronics from external influences such as humidity and mechanical stress, and can take over housing problems.
 

Moulded Grommets
splash up sleeves, where it is needed, that is the strength of the process. Beads of the annoying rubber grommets deleted and you get an additional strain relief. The Macromelt-Schmelzgussverfahren is efficient because the hot melts are body shape and adhesive function übernehmen.Die investment costs low and the production tool is favorable. The whole system has a hohenAutomatisierungsgrad and is flexible, thanks to short changeover times.

(This text has been translated from German by machine)